Specs:
2 layer, 1.6mm thick
2 oz copper
tented vias

Outline/Mechanical Drawing: (3.900"x3.900")
	RE-07.MCH

Layer Order: 
	RE-07.L01 (top component side)
	RE-07.L02 (bottom side)

Green Soldermask:
	RE-07.TSM (top component side)
	RE-07.BSM (bottom side)

Silk Screen:
	RE-07.SLK (component side)

Solder Paste Screen: (0.12mm thickness)
	RE-07.TSP (top component side)

L01-Top side Image (color is copper area)
	RE-07-L01-image.jpg

L01-Bottom side Image (color is copper area)
	RE-07-L02-image.jpg

